At a glance
- Date range
- City
- Stuttgart
- Country
- Germany
- Industry
- Chemicals, Lab & Raw Materials
- Type of trade show
- B2B
- Frequency
- Yearly
- Organizer
- P. E. Schall GmbH & Co. KG
- Tickets
- No information
October 24–26, 2028 in Stuttgart, Germany. Bondexpo is an international trade fair for bonding technology and joining processes, aimed at users from industry and manufacturing.
Visit organizer websiteBondexpo 2028 is an international trade fair for bonding technology and takes place in Stuttgart from 24 to 26 October 2028. The focus is on the process chain of joining by gluing, moulding, sealing and foaming for a wide range of materials. Further topics are assembly automation, robotics, assembly assistance systems as well as connected, smart production components.
The fair is aimed at trade visitors from design, manufacturing and assembly who plan or use bonding and sealing processes. In 2024 it counted 409 exhibitors and 18,948 visitors. The organiser is P. E. Schall GmbH & Co. KG.
Via the A 8 and A 81. Address for navigation: Messepiazza 1, 70629 Stuttgart.
S-Bahn S2, S3; U-Bahn U6. Stop: Flughafen/Messe.
Nearest airport: Stuttgart (STR), approx. 1 km straight-line distance from the venue; approx. 27 min according to the organiser.
Then stop leaving any lead behind: with snapAddy you capture every contact digitally at your booth, and it goes straight into your CRM without manual typing.
Ticket prices are not available here. Please contact the organizer.
Bondexpo 2028 takes place from 24 to 26 October 2028 at Messe Stuttgart, Messepiazza 1, 70629 Stuttgart.
The exhibitors of Bondexpo 2028 are listed in the exhibitor list on the Bondexpo website.
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